EDTEK has multi-source metal deposition facilities for thin film metal fabrication. Both e-beam and thermal evaporation sources are available. The thin film deposition of gold, silver, platinum, nickel, titanium, and molybdenum are performed on a regular basis with the deposition of other metals available upon request. We have fabricated a number of different multilayer metallization systems for semiconductor devices. Rapid thermal annealing is also available for promoting low resistance ohmic contacts.

EDTEK has both PECVD (Plasma Enhanced Chemical Vapor Deposition) and sputtering capabilities for growing nitride and SiO passivation layers. We halved processed nitride and SiO layers on semiconductors. For fabricating antireflection coatings we have an ion assisted e-beam deposition system as well as a sputtering system.

Two diffusion tubes are available. One is dedicated to zinc doping of III-V compound semiconductors. The other tube is set up for annealing in various ambients and can be tailored to customer needs. Add Content...

Optical lithography for the transferring of patterns onto metallic or semiconductor substrates. The resolution of the printed pattern allows line widths down to 3 microns. For higher resolution requirements, ion beam lithography is available at EDTEK with resolution as low as 30 nm. This MEMS capabiity utilizes silicon membrane stencils with an overall printing area of 6" x 6".

EDTEK processing capability includes reactive ion etching employing numerous gas chemistries, wet etching, thin film metallizations, dielectric deposition, small scale metal plating, thin film polymer application by substrate spinning, and application and development of various photoresist systems. This capability may be applied to your entire process start to finish or to a few critical steps of your process.

Diagnostic and failure analysis capabilities are available including; pprofilometry for thin film thickness determination and surface roughness measurements, ellipsometry for thickness and optical properties of dielectric thin films, spectroscopy (from 0.300 microns to 30 microns) for determining optical properties of solids and liquids, optical microscopy with resolution down to 1 micron and scanning electron microscopy with resolution to 10 nanometer.